The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Feb. 17, 2017
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Andreas Fischer, Castro Valley, CA (US);

Thorsten Lill, Santa Clara, CA (US);

Richard Janek, Oakland, CA (US);

John Boniface, San Jose, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/06 (2006.01); C23C 16/02 (2006.01); C23F 4/00 (2006.01); H01L 21/3213 (2006.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01); H01J 37/32 (2006.01); C23F 1/00 (2006.01); C23F 1/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31122 (2013.01); C23C 16/0245 (2013.01); C23F 1/00 (2013.01); C23F 1/12 (2013.01); C23F 4/00 (2013.01); H01J 37/32009 (2013.01); H01J 37/32082 (2013.01); H01L 21/30655 (2013.01); H01L 21/32136 (2013.01); B81C 2201/0135 (2013.01); B81C 2201/0142 (2013.01); H01J 2237/334 (2013.01);
Abstract

A method for performing atomic layer etching (ALE) on a substrate, including the following method operations: performing a surface modification operation on a surface of the substrate, the surface modification operation configured to convert at least one monolayer of the substrate surface to a modified layer; performing a removal operation on the substrate surface, the removal operation configured to remove the modified layer from the substrate surface, wherein removing the modified layer occurs via a ligand exchange reaction that is configured to volatilize the modified layer; performing, following the removal operation, a plasma treatment on the substrate surface, the plasma treatment configured to remove residues generated by the removal operation from the substrate surface, wherein the residues are volatilized by the plasma treatment; repeating the foregoing operations until a predefined thickness has been etched from the substrate surface.


Find Patent Forward Citations

Loading…