Inspection apparatus and method using pattern matching

Abstract

To provide means according to which template matching is performed successfully in an apparatus that performs inspection or measurement of a semiconductor pattern, which is formed on a wafer, even in a case in which a pattern for alignment, which is in design data, has been eliminated from an image in which an image of a practical pattern was captured using the apparatus, in which the brightness value contrast of a pattern is lower (more indistinct) than that of other locations, or in which a pattern is deformed and there is a discrepancy with the shape of a template (a pattern for alignment in the design data). An inspection apparatus according to the invention acquires a target retrieval image, and carries out template matching on the target retrieval image, and includes template input, means for inputting a plurality of templates, a plurality of matching candidate selection sections that select a matching candidate group by performing a matching process of the target retrieval image and the plurality of templates, a plurality of single template likelihood calculation process sections that calculate single template likelihoods for a plurality of matching candidate groups that are selected by the plurality of matching candidate selection sections, a multiple template assimilation likelihood calculation process section that calculates a multiple template assimilation likelihood for the matching candidate groups using a plurality of single template likelihoods that are calculated by the plurality of single template likelihood calculation process sections, and a highest assimilation likelihood matching candidate selection section that selects a matching candidate for which the multiple template assimilation on likelihood is the highest, from among the matching candidate groups, using the multiple template assimilation likelihoods that are calculated by the multiple template assimilation likelihood calculation process section.