The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Mar. 30, 2015
Applicant:
Nitta Haas Incorporated, Osaka, JP;
Inventors:
Masashi Teramoto, Kyoto, JP;
Tatsuya Nakauchi, Kyoto, JP;
Noriaki Sugita, Kyoto, JP;
Shinichi Haba, Kyoto, JP;
Akiko Miyamoto, Kyoto, JP;
Assignee:
NITTA HAAS INCORPORATED, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02008 (2013.01); H01L 21/02024 (2013.01);
Abstract
Proposed is a method for polishing a semiconductor substrate including an intermediate polishing step of polishing in such a way that the number of surface defects having heights of less than 3 nm is 45% or more of the total number of the surface defects on the surface of a semiconductor substrate, and a final polishing step of finish-polishing the semiconductor substrate after the intermediate polishing step.