The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

May. 16, 2016
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Yasuhiro Kagawa, Tokyo, JP;

Rina Tanaka, Tokyo, JP;

Yutaka Fukui, Tokyo, JP;

Katsutoshi Sugawara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01); H01L 29/10 (2006.01); H01L 21/04 (2006.01); H01L 29/66 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0615 (2013.01); H01L 21/0465 (2013.01); H01L 29/1045 (2013.01); H01L 29/1095 (2013.01); H01L 29/66068 (2013.01); H01L 29/7397 (2013.01); H01L 29/7811 (2013.01); H01L 29/7813 (2013.01); H01L 21/049 (2013.01); H01L 21/0485 (2013.01); H01L 29/1602 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01);
Abstract

A protective diffusion region includes a first protective diffusion region at a location closest to a termination region, and a second protective diffusion region located away from the first protective diffusion region with a first space therebetween. A second space that is a distance between a termination diffusion region and the first protective diffusion region is greater than the first space. A current diffusion layer of a first conductivity type includes a first current diffusion layer located between the first protective diffusion region and the second protective diffusion region and having a higher impurity concentration than a drift layer, and a second current diffusion layer located between the first protective diffusion region and the termination diffusion region. The second current diffusion layer includes a region having a lower impurity concentration than the current diffusion layer.


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