The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Mar. 10, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Gyu-hee Park, Hwaseong-si, KR;
Jae-soon Lim, Seoul, KR;
Youn-joung Cho, Hwaseong-si, KR;
Myong-woon Kim, Daejeon, KR;
Sang-ick Lee, Daejeon, KR;
Sung-duck Lee, Daejeon, KR;
Sung-woo Cho, Daegu, KR;
Assignees:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
DNF Co., Ltd., Daejeon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C07F 5/06 (2006.01); C09D 1/00 (2006.01); C09D 5/24 (2006.01); H01L 21/311 (2006.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 21/02178 (2013.01); C07F 5/062 (2013.01); C09D 1/00 (2013.01); C09D 5/24 (2013.01); H01L 21/0228 (2013.01); H01L 21/02205 (2013.01); H01L 21/02321 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 27/11582 (2013.01);
Abstract
An aluminum compound is represented by Chemical Formula (I) and is used as a source material for forming an aluminum-containing thin film.
Quick Actions:
Park, Gyu-hee. (2019). Aluminum compound, method of forming thin film by using the same, and method of fabricating integrated circuit device (U.S. Patent No. 10224200). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10224200
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile