The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Mar. 30, 2017
Applicant:

Silicon Storage Technology, Inc., San Jose, CA (US);

Inventors:

Feng Zhou, Fremont, CA (US);

Xian Liu, Sunnyvale, CA (US);

Chien-Sheng Su, Saratoga, CA (US);

Nhan Do, Saratoga, CA (US);

Chunming Wang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/788 (2006.01); H01L 27/07 (2006.01); H01L 29/08 (2006.01); H01L 29/423 (2006.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66825 (2013.01); H01L 21/28273 (2013.01); H01L 27/0705 (2013.01); H01L 29/0847 (2013.01); H01L 29/42328 (2013.01); H01L 29/6653 (2013.01); H01L 29/66545 (2013.01); H01L 29/788 (2013.01); G11C 2216/10 (2013.01);
Abstract

A simplified method for forming pairs of non-volatile memory cells using two polysilicon depositions. A first polysilicon layer is formed on and insulated from the semiconductor substrate in a first polysilicon deposition process. A pair of spaced apart insulation blocks are formed on the first polysilicon layer. Exposed portions of the first poly silicon layer are removed while maintaining a pair of polysilicon blocks of the first polysilicon layer each disposed under one of the pair of insulation blocks. A second polysilicon layer is formed over the substrate and the pair of insulation blocks in a second polysilicon deposition process. Portions of the second polysilicon layer are removed while maintaining a first polysilicon block (disposed between the pair of insulation blocks), a second polysilicon block (disposed adjacent an outer side of one insulation block), and a third polysilicon block (disposed adjacent an outer side of the other insulation block).


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