The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Mar. 02, 2017
Applicant:

Tokyo Electron Limited, Minato-ku, Tokyo, JP;

Inventors:

Taejoon Han, Clifton Park, NY (US);

Daniel Morvay, Mechanicville, NY (US);

Mirko Vukovic, Slingerlands, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 3/30 (2006.01); G01N 21/73 (2006.01); H01J 37/32 (2006.01); G06T 11/00 (2006.01); G01J 3/443 (2006.01); H01L 21/3065 (2006.01); H01L 21/67 (2006.01); G01N 21/68 (2006.01); G01N 21/17 (2006.01);
U.S. Cl.
CPC ...
G01N 21/73 (2013.01); G01J 3/443 (2013.01); G01N 21/68 (2013.01); G06T 11/003 (2013.01); H01J 37/32422 (2013.01); H01J 37/32972 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); G01N 2021/1787 (2013.01); G01N 2201/1293 (2013.01); H01J 2237/334 (2013.01);
Abstract

Described herein are technologies to facilitate computed tomographic techniques to help identifying chemical species during plasma processing of a substrate (e.g., semiconductor wafer) using optical emission spectroscopy (OES). More particularly, the technology described herein uses topographic techniques to spatially resolves emissions and absorptions in at least two-dimension space above the substrate during the plasma processing (e.g., etching) of the substrate. With some implementations utilize optical detectors positioned along multiple axes (e.g., two or more) to receive incident incoming optical spectra from the plasma chamber during the plasma processing (e.g., etching) of the substrate. Because of the multi-axes arrangement, the incident incoming optical spectra form an intersecting grid.


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