The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Dec. 04, 2017
Applicants:

United Microelectronics Corp., Hsin-Chu, TW;

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian Province, CN;

Inventors:

Kai-Jiun Chang, Taoyuan, TW;

Yi-Wei Chen, Taichung, TW;

Tsun-Min Cheng, Changhua County, TW;

Chia-Chen Wu, Nantou County, TW;

Pin-Hong Chen, Tainan, TW;

Chih-Chieh Tsai, Kaohsiung, TW;

Tzu-Chieh Chen, Pingtung County, TW;

Yi-An Huang, New Taipei, TW;

Assignees:

UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/778 (2006.01); H01L 29/45 (2006.01); H01L 21/768 (2006.01); H01L 21/3205 (2006.01); H01L 21/4763 (2006.01); H01L 27/108 (2006.01); H01L 23/532 (2006.01); H01L 21/02 (2006.01); H01L 23/535 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10891 (2013.01); H01L 21/02068 (2013.01); H01L 21/76852 (2013.01); H01L 21/76895 (2013.01); H01L 23/535 (2013.01); H01L 23/53266 (2013.01);
Abstract

A method for fabricating a buried word line (BWL) of a dynamic random access memory (DRAM) includes the steps of: forming a trench in a substrate; forming a barrier layer in the trench; performing a soaking process to reduce chlorine concentration in the barrier layer; and forming a conductive layer to fill the trench.


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