The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Dec. 08, 2015
Applicant:

University of Houston System, Houston, TX (US);

Inventors:

Vincent M. Donnelly, Houston, TX (US);

Demetre J. Economou, Houston, TX (US);

Siyuan Tian, Houston, TX (US);

Assignee:

UNIVERSITY OF HOUSTON SYSTEM, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B82Y 30/00 (2011.01); B29D 11/00 (2006.01); G03F 1/20 (2012.01); H01J 37/302 (2006.01); H01J 37/317 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
B29D 11/00375 (2013.01); B29D 11/00 (2013.01); B29D 11/00365 (2013.01); B82Y 30/00 (2013.01); G03F 1/20 (2013.01); H01J 37/3026 (2013.01); H01J 37/3174 (2013.01); H01L 21/0274 (2013.01); H01J 2237/21 (2013.01); H01J 2237/2811 (2013.01); H01J 2237/2817 (2013.01); H01J 2237/31776 (2013.01);
Abstract

Nanopantography is a method for patterning nanofeatures over large areas. Transfer of patterns defined by nanopantography using highly selective plasma etching, with an oxide layer of silicon serving as a hard mask, can improve patterning speed and etch profile. With this method, high aspect ratio features can be fabricated in a substrate with no mask undercut. The ability to fabricate complex patterns using nanopantography, followed by highly selective plasma etching, provides improved patterning speed, feature aspect ratio, and etching profile.


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