The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Jul. 21, 2017
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

En-Chiuan Liou, Tainan, TW;

Yu-Cheng Tung, Kaohsiung, TW;

Ching-Ling Lin, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0638 (2013.01); H01L 21/76237 (2013.01); H01L 29/0649 (2013.01); H01L 29/66803 (2013.01); H01L 29/7851 (2013.01);
Abstract

A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate, a first dielectric layer, a first doping layer of a first conductivity type, and a second doping layer of a second conductivity type. The substrate has a fin portion. The first dielectric layer is disposed on the substrate and surrounds the fin portion. The first doping layer of the first conductivity type is disposed on the first dielectric layer and is located on two opposite sidewalls of the fin portion. The second doping layer of the second conductivity type is disposed on the two opposite sidewalls of the fin portion and is located between the fin portion and the first doping layer. The first doping layer covers a sidewall and a bottom surface of the second doping layer.


Find Patent Forward Citations

Loading…