The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
May. 14, 2015
Fujibo Holdings, Inc., Chuo-ku, Tokyo, JP;
Shin-etsu Handotai Co., Ltd, Chiyoda-ku, Tokyo, JP;
Michito Sato, Fukushima, JP;
Junichi Ueno, Fukushima, JP;
Kaoru Ishii, Fukushima, JP;
Yoshihide Kawamura, Saijo, JP;
Hiroshi Yoshida, Saijo, JP;
Masataka Takagi, Saijo, JP;
FUJIBO HOLDINGS, INC., Chuo-ku, Tokyo, JP;
SHIN-ETSU HANDOTAI CO., LTD., Chiyoda-ku, Tokyo, JP;
Abstract
Provided is a polishing pad capable of sufficiently reducing minute defects to be generated after polishing on a workpiece which are detected in measurement for a particle size of 26 nm or smaller and capable of providing the workpiece with excellent surface flatness. The polishing pad includes a polishing layer having a polishing surface to polish a workpiece, and includes, in the side opposite to the polishing surface of the polishing layer, an intermediate layer having an amount of deformation C larger than that of the polishing layer, a hard layer having an amount of deformation C smaller than that of the polishing layer, and a cushion layer having an amount of deformation C larger than that of the intermediate layer, in which each of the amounts of deformations C is defined as an amount of deformation in the case of compression in a thickness direction, and the intermediate layer, the hard layer, and the cushion layer are laminated in this order from the side of the polishing layer.