The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Jul. 08, 2016
Applicant:

Crossbar, Inc., Santa Clara, CA (US);

Inventors:

Mark Harold Clark, Santa Clara, CA (US);

Natividad Vasquez, San Francisco, CA (US);

Steven Maxwell, Sunnyvale, CA (US);

Assignee:

CROSSBAR, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 47/00 (2006.01); H01L 29/76 (2006.01); H01L 27/24 (2006.01); H01L 45/00 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 27/2463 (2013.01); H01L 23/528 (2013.01); H01L 27/2436 (2013.01); H01L 45/1233 (2013.01); H01L 45/1253 (2013.01); H01L 45/148 (2013.01); H01L 45/1608 (2013.01);
Abstract

A method for forming a resistive switching device. The method includes providing a substrate having a surface region and forming a first dielectric material overlying the surface region. A first wiring structure is formed overlying the first dielectric material. The method forms one or more first structure comprising a junction material overlying the first wiring structure. A second structure comprising a stack of material is formed overlying the first structure. The second structure includes a resistive switching material, an active conductive material overlying the resistive switching material, and a second wiring material overlying the active conductive material. The second structure is configured such that the resistive switching material is free from a coincident vertical sidewall region with the junction material.


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