The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
May. 18, 2016
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chi-Hao Huang, Miaoli County, TW;
Hsuan-Pang Liu, Hsinchu, TW;
Yuan-Chun Sie, Miaoli County, TW;
Pinyen Lin, Rochester, NY (US);
Cheng-Chung Chien, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/20 (2012.01); B24D 18/00 (2006.01); B24B 37/22 (2012.01); B24B 37/26 (2012.01);
U.S. Cl.
CPC ...
B24B 37/20 (2013.01); B24B 37/22 (2013.01); B24B 37/26 (2013.01); B24D 18/0045 (2013.01);
Abstract
A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.