The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Jul. 05, 2016
Applicant:

Maxpower Semiconductor, Inc., San Jose, CA (US);

Inventors:

Hamza Yilmaz, San Jose, CA (US);

Mohamed N. Darwish, Campbell, CA (US);

Richard A. Blanchard, Los Altos, CA (US);

Assignee:

MaxPower Semiconductor, Inc., San Jose, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 27/02 (2006.01); H01L 27/06 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 29/08 (2006.01); H01L 27/07 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0634 (2013.01); H01L 27/067 (2013.01); H01L 29/0692 (2013.01); H01L 29/0834 (2013.01); H01L 29/0878 (2013.01); H01L 29/0886 (2013.01); H01L 29/1095 (2013.01); H01L 29/402 (2013.01); H01L 29/404 (2013.01); H01L 29/41758 (2013.01); H01L 29/66659 (2013.01); H01L 29/66681 (2013.01); H01L 29/66689 (2013.01); H01L 29/66696 (2013.01); H01L 29/7393 (2013.01); H01L 29/7816 (2013.01); H01L 29/7818 (2013.01); H01L 29/7835 (2013.01); H01L 27/0727 (2013.01);
Abstract

In one embodiment, a RESURF structure between a source and a drain in a lateral MOSFET is formed in a trench having a flat bottom surface and angled sidewalls toward the source. Alternating P and N-type layers are epitaxially grown in the trench, and their charges balanced to achieve a high breakdown voltage. In the area of the source, the ends of the P and N-layers angle upward to the surface under the lateral gate and contact the body region. Thus, for an N-channel MOSFET, a positive gate voltage above the threshold forms a channel between the source and the N-layers in the RESURF structure as well as creates an inversion of the ends of the P-layers near the surface for low on-resistance. In another embodiment, the RESURF structure is vertically corrugated by being formed around trenches, thus extending the length of the RESURF structure for a higher breakdown voltage.


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