The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Feb. 22, 2017
Applicant:

Bridge Semiconductor Corporation, Taipei, TW;

Inventors:

Charles W. C. Lin, Singapore, SG;

Chia-Chung Wang, Hsinchu County, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H01L 23/24 (2006.01); H01L 23/16 (2006.01); H01L 23/433 (2006.01); H01L 21/48 (2006.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/486 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 23/16 (2013.01); H01L 23/24 (2013.01); H01L 23/3121 (2013.01); H01L 23/4334 (2013.01); H01L 23/5389 (2013.01); H01L 23/544 (2013.01); H01L 24/02 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H01L 23/367 (2013.01); H01L 23/373 (2013.01); H01L 23/3731 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68386 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81207 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/8314 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/381 (2013.01);
Abstract

A semiconductor assembly includes an anti-warping controller, a semiconductor device, a balance layer and a first routing circuitry positioned within a through opening of a stiffener and a second routing circuitry positioned outside of the through opening of the stiffener and electrically connected to the first routing circuitry and a vertical connecting element of the stiffener. The mechanical robustness of the stiffener and the anti-warping controller can prevent the assembly from warping, whereas the vertical connecting element of the stiffener provides electrical connection between two opposite sides of the stiffener. The first routing circuitry can enlarge the pad size and pitch of the semiconductor device, whereas the second routing circuitry not only provides further fan-out wiring structure, but also mechanically binds the first routing circuitry with the stiffener.


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