The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Mar. 03, 2017
Applicants:

International Business Machines Corporation, Armonk, NY (US);

Stmicroelectronics, Inc., Coppell, TX (US);

Inventors:

Stephane Allegret-Maret, Grenoble, FR;

Kangguo Cheng, Schenectady, NY (US);

Bruce Doris, Slingerlands, NY (US);

Prasanna Khare, Schenectady, NY (US);

Qing Liu, Irvine, CA (US);

Nicolas Loubet, Guilderland, NY (US);

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 27/092 (2006.01); H01L 27/11 (2006.01); H01L 21/8238 (2006.01); H01L 21/84 (2006.01); H01L 29/786 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01); H01L 21/762 (2006.01); H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/165 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 27/092 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/02532 (2013.01); H01L 21/26513 (2013.01); H01L 21/3065 (2013.01); H01L 21/31111 (2013.01); H01L 21/76224 (2013.01); H01L 21/823807 (2013.01); H01L 21/823814 (2013.01); H01L 21/823828 (2013.01); H01L 21/823878 (2013.01); H01L 21/84 (2013.01); H01L 27/1104 (2013.01); H01L 27/1116 (2013.01); H01L 27/1203 (2013.01); H01L 29/0649 (2013.01); H01L 29/0847 (2013.01); H01L 29/165 (2013.01); H01L 29/41783 (2013.01); H01L 29/6656 (2013.01); H01L 29/66772 (2013.01); H01L 29/78654 (2013.01);
Abstract

An improved transistor with channel epitaxial silicon. In one aspect, a method of fabrication includes: forming a gate stack structure on an epitaxial silicon region disposed on a substrate, a width dimension of the epitaxial silicon region approximating a width dimension of the gate stack structure; and growing a raised epitaxial source and drain from the substrate, the raised epitaxial source and drain in contact with the epitaxial silicon region and the gate stack structure. For a SRAM device, further: removing an epitaxial layer in contact with the silicon substrate and the raised source and drain and to which the epitaxial silicon region is coupled leaving a space above the silicon substrate and under the raised epitaxial source and drain; and filling the space with an insulating layer and isolating the raised epitaxial source and drain and a channel of the transistor from the silicon substrate.


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