The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Apr. 05, 2017
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Wei-Ming Chen, Taipei, TW;
Tu-Hao Yu, Hsinchu, TW;
Kuo-Chiang Ting, Hsinchu, TW;
Shang-Yun Hou, Jubei, TW;
Chi-Hsi Wu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
Chip on wafer on substrate structures and methods of forming are provided. The method includes attaching a first die and a second die to an interposer. The method also includes attaching a first substrate to a first surface of the first die and a first surface of the second die. The first substrate includes silicon. The first surface of the first side is opposite to the surface of the first die that is attached to the interposer, and the first surface of the second die is opposite to the surface of the second die that is attached to the interposer. The method includes bonding the interposer to a second substrate.