The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Nov. 07, 2011
Tsung-ding Wang, Tainan, TW;
Chien-hsiun Lee, Hsin-Chu, TW;
Tsung-Ding Wang, Tainan, TW;
Chien-Hsiun Lee, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method comprises connecting a substrate having a plurality of integrated circuit (IC) dies to a package substrate, so that the package substrate extends beyond at least two edges of the substrate, leaving first and second edge portions of the package substrate having exposed contacts. The first and second edge portions meet at a first corner of the package substrate. At least a first upper die package is placed over the substrate, so that first and second edge portions of the first upper die package extend beyond the at least two edges of the substrate. Pads on the first and second edge portions of the first upper die package are connected to the contacts of the first and second edge portions of the package substrate.