The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Nov. 20, 2015
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Jin Lu, Boise, ID (US);
Rita J. Klein, Boise, ID (US);
Diem Thy N. Tran, Garden City, ID (US);
Irina V. Vasilyeva, Boise, ID (US);
Zhiqiang Xie, Meridian, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3212 (2013.01); H01L 21/02063 (2013.01); H01L 21/02274 (2013.01); H01L 21/31116 (2013.01); H01L 21/76831 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 21/76828 (2013.01);
Abstract
Apparatuses and methods are disclosed herein for densification of through substrate insulating liners. An example method may include forming a through substrate via through at least a portion of a substrate, forming a first liner layer in the through substrate via, and densifying the first liner layer. The example method may further include forming a second liner layer on the first liner layer, and densifying the second liner layer.