The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Jan. 04, 2016
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); H01L 21/306 (2006.01); H01L 21/02 (2006.01); G01N 21/3563 (2014.01); G01N 21/65 (2006.01); G01N 21/59 (2006.01); G01N 15/02 (2006.01); G01N 21/53 (2006.01); G01N 21/55 (2014.01); G01N 21/94 (2006.01); G01N 21/95 (2006.01); G01N 21/35 (2014.01); G01N 15/14 (2006.01); G01N 15/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G01N 15/0211 (2013.01); G01N 15/1459 (2013.01); G01N 21/3563 (2013.01); G01N 21/53 (2013.01); G01N 21/55 (2013.01); G01N 21/59 (2013.01); G01N 21/65 (2013.01); G01N 21/94 (2013.01); G01N 21/9501 (2013.01); H01L 21/02057 (2013.01); H01L 21/30625 (2013.01); G01N 2015/0053 (2013.01); G01N 2015/0222 (2013.01); G01N 2015/1486 (2013.01); G01N 2015/1493 (2013.01); G01N 2021/3568 (2013.01); G01N 2021/3595 (2013.01);
Abstract
A method includes performing Chemical Mechanical Polish (CMP) on a wafer, placing the wafer on a chuck, performing a post-CMP cleaning on the wafer, and determining cleanness of the wafer when the wafer is located on the chuck.