The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Nov. 29, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Michael P Belyansky, Bethel, CT (US);

Ravi K Bonam, Albany, NY (US);

Anuja Desilva, Slingerlands, NY (US);

Scott Halle, Slingerlands, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/033 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); G03F 7/00 (2013.01); H01L 21/0228 (2013.01); H01L 21/02172 (2013.01); H01L 21/02266 (2013.01); H01L 21/02323 (2013.01); H01L 21/02356 (2013.01); H01L 21/0332 (2013.01); H05K 999/99 (2013.01);
Abstract

A method is disclosed to prepare a substrate for photolithography. The method includes forming an underlayer over a surface of the substrate; depositing an interface hardmask layer on the underlayer using one of a vapor phase deposition process or an atomic layer deposition process; and forming a layer of extreme UV (EUV) resist on the interface hardmask layer, where the interface hardmask layer is comprised of material having a composition and properties tuned to achieve a certain secondary electron yield from the interface hardmask layer. Also disclosed is a structure configured for photolithography. The structure includes a substrate; an underlayer over a surface of the substrate; an interface hardmask layer disposed on the underlayer; and a layer of EUV resist disposed on the interface hardmask layer. The interface hardmask layer contains material having a composition and properties tuned to achieve a certain secondary electron yield from the interface hardmask layer.


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