The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Feb. 05, 2016
Applicant:

Hitachi High-technologies Corporation, Tokyo, JP;

Inventors:

Hironori Kusumoto, Kudamatsu, JP;

Yutaka Ohmoto, Hikari, JP;

Kazunori Nakamoto, Kudamatsu, JP;

Koji Nagai, Kudamatsu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 37/32082 (2013.01); H01J 37/32192 (2013.01); H01J 37/32522 (2013.01); H01J 37/32825 (2013.01); H01L 21/67069 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01J 2237/334 (2013.01);
Abstract

There is disclosed a plasma processing apparatus for processing a wafer put on a sample stage disposed in a processing chamber within a vacuum vessel by the use of a plasma generated in the processing chamber after mounting the wafer on the sample stage. The apparatus has heaters in areas of the interior of the sample stage which are divided radially and circumferentially. At least those of the heaters which are arranged in the areas located in the radially outer position include circumferentially arranged heater portions that are connected in series. The amounts of heat generated by these circumferentially arranged heater portions are adjusted.


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