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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10134794 B1

PDFFull Text
Date of Patent:
Nov. 20, 2018

Filed:

Apr. 14, 2017

Image sensor chip sidewall interconnection

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Kuo-Chin Huang, Yilan, TW;

Pao-Tung Chen, Tainan Hsien, TW;

Wei-Chieh Chiang, Yuanlin Township, TW;

Kazuaki Hashimoto, Zhubei, TW;

Jen-Cheng Liu, Hsin-Chu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Attorney:

Eschweiler & Potashnik, LLC

Primary Examiner:

Andres Munoz

Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14685 (2013.01);
Abstract

An image sensor chip having a sidewall interconnect structure to bond and/or electrically couple the image sensor chip to a package substrate is provided. The image sensor chip includes a substrate supporting an integrated circuit (IC) configured to sense incident light. The sidewall interconnect structure is arranged along a sidewall of the substrate and electrically coupled with the IC. A method for manufacturing the image sensor chip and an image sensor package including the image sensor chip are also provided.

Find Patent Forward Citations

Huang, Kuo-Chin. (2018). Image sensor chip sidewall interconnection (U.S. Patent No. 10134794). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10134794

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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