The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Nov. 02, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Wen-I Hsu, Tainan, TW;

Min-Feng Kao, Chiayi, TW;

Jen-Cheng Liu, Hsin-Chu, TW;

Dun-Nian Yaung, Taipei, TW;

Tzu-Hsuan Hsu, Kaohsiung, TW;

Wen-De Wang, Minsyong Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 27/146 (2006.01); H01L 29/06 (2006.01); H01L 21/762 (2006.01); H01L 21/761 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14689 (2013.01); H01L 21/761 (2013.01); H01L 21/76237 (2013.01); H01L 27/1463 (2013.01); H01L 29/0649 (2013.01); H01L 27/14643 (2013.01);
Abstract

A system and method for isolating semiconductor devices is provided. An embodiment comprises an isolation region that is laterally removed from source/drain regions of semiconductor devices and has a dielectric material extending over the isolation implant between the source/drain regions. The isolation region may be formed by forming an opening through a layer over the substrate, depositing a dielectric material along the sidewalls of the opening, implanting ions into the substrate after the deposition, and filling the opening with another dielectric material.


Find Patent Forward Citations

Loading…