The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Aug. 08, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masahiro Fukuda, Koshi, JP;

Hiroshi Ichinomiya, Koshi, JP;

Koichi Obata, Koshi, JP;

Taro Yamamoto, Koshi, JP;

Kouichirou Tanaka, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/67 (2006.01); B05C 5/02 (2006.01); B05C 11/08 (2006.01); B05C 11/10 (2006.01); B08B 3/08 (2006.01); B08B 3/10 (2006.01); G03F 7/16 (2006.01); H01L 21/027 (2006.01); G03F 7/30 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6715 (2013.01); B05C 5/0258 (2013.01); B05C 11/08 (2013.01); B05C 11/1002 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); G03F 7/162 (2013.01); G03F 7/3021 (2013.01); H01L 21/0273 (2013.01); H01L 21/67051 (2013.01); H01L 21/67178 (2013.01);
Abstract

There is provided a guide memberin which an inclined surfacethereof is inclined downwardly outwards from an edge portion of a rear surface of a horizontally held wafer W; and a cylindrical surrounding memberwhich surrounds the wafer W and in which an upper peripheral portion thereof is inwardly extended obliquely upwards. Further, the surrounding memberhas, at an inner surface side thereof, two groove portionsextended along an entire circumference and located above a height position of the horizontally held wafer W. If an air flow flows along the surrounding member, a vortex flow is formed within the groove portionsand stays therein. Thus, mist can be captured, so that the flow of the mist to the outside of a cup bodycan be suppressed. Accordingly, the adhesion of the mist to the wafer W can be suppressed.


Find Patent Forward Citations

Loading…