The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Sep. 29, 2017
Intel Corporation, Santa Clara, CA (US);
Aleksandar Aleksov, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Arnab Sarkar, Chandler, AZ (US);
Hiroki Tanaka, Chandler, AZ (US);
Robert A. May, Chandler, AZ (US);
Sri Ranga Sai Boyapati, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure may relate to a package substrate that may include a layer having a layer surface that is planarized and a via within the layer, where the via includes a via surface that is exposed on the layer surface, and where the via surface is planarized. The package substrate may further include a bond pad on the layer surface, where a first thickness of the bond pad includes a seed layer on the via surface, and where a second thickness of the bond pad includes a plating stack on the seed layer. Other embodiments may be described or claimed.