The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Nov. 29, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Koji Kagawa, Koshi, JP;

Hisashi Kawano, Koshi, JP;

Meitoku Aibara, Koshi, JP;

Yuki Yoshida, Koshi, JP;

Assignee:

Tokyo Electron Limited, Minato-Ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0206 (2013.01); H01L 21/6719 (2013.01); H01L 21/67028 (2013.01); H01L 21/67034 (2013.01); H01L 21/67051 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H05K 999/99 (2013.01);
Abstract

In order to remove from a substrate having a concavo-convex pattern formed on a surface of the substrate, a solid material with which a concave portion of the concavo-convex pattern is filled and which is formed by evaporating a solvent in a sublimable substance solution containing a sublimable substance that sublimates at a temperature equal to or higher than a first temperature, and an impurity that evaporates at a temperature equal to or higher than a second temperature that is higher than the first temperature, the prevent invention provides a substrate processing apparatus and a substrate processing method which heat the substrate to a temperature equal to or higher than the second temperature.


Find Patent Forward Citations

Loading…