The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Jun. 13, 2016
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/58 (2006.01); H01L 23/00 (2006.01); H01L 23/16 (2006.01); H01L 23/544 (2006.01); H01L 23/10 (2006.01); H01L 23/433 (2006.01); H01L 23/28 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 23/48 (2006.01); H01L 23/14 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3157 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/76898 (2013.01); H01L 21/78 (2013.01); H01L 23/10 (2013.01); H01L 23/147 (2013.01); H01L 23/16 (2013.01); H01L 23/28 (2013.01); H01L 23/31 (2013.01); H01L 23/4334 (2013.01); H01L 23/481 (2013.01); H01L 23/49805 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/544 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 21/563 (2013.01); H01L 23/562 (2013.01); H01L 2021/6024 (2013.01); H01L 2224/02235 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/17505 (2013.01); H01L 2224/17517 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81139 (2013.01); H01L 2224/92124 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/06 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A semiconductor package includes an interposer chip having a frontside, a backside, and a corner area on the backside defined by a first corner edge and a second corner edge of the interposer chip. A die is bonded to the frontside of the interposer chip. At least one dam structure is formed on the corner area of the backside of the interposer chip. The dam structure includes an edge aligned to at least one the first corner edge and the second corner edge of the interposer chip.