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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10114287 B1

PDFFull Text
Date of Patent:
Oct. 30, 2018

Filed:

Sep. 15, 2015

Silicone skeleton-containing polymer compound and method for producing same, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, and substrate

Applicant:

Shin-etsu Chemical Co., Ltd., Chiyoda-ku, JP;

Inventors:

Hiroyuki Urano, Jyoetsu, JP;

Masashi Iio, Jyoetsu, JP;

Katsuya Takemura, Jyoetsu, JP;

Koji Hasegawa, Jyoetsu, JP;

Masahiro Fukushima, Jyoetsu, JP;

Takayuki Fujiwara, Jyoetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Amanda C Walke

Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/075 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); C09D 183/14 (2006.01); C08L 83/14 (2006.01); C07C 39/21 (2006.01); H01L 21/027 (2006.01); C08G 77/52 (2006.01); C08G 77/38 (2006.01); C08G 77/16 (2006.01); C08G 77/18 (2006.01); G03F 7/16 (2006.01); G03F 7/38 (2006.01); G03F 7/40 (2006.01); C08K 5/09 (2006.01); G03F 7/038 (2006.01); G03F 7/11 (2006.01); C08G 77/14 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0757 (2013.01); C07C 39/21 (2013.01); C08G 77/16 (2013.01); C08G 77/18 (2013.01); C08G 77/38 (2013.01); C08G 77/52 (2013.01); C08K 5/09 (2013.01); C08L 83/14 (2013.01); C09D 183/14 (2013.01); G03F 7/038 (2013.01); G03F 7/0382 (2013.01); G03F 7/11 (2013.01); G03F 7/168 (2013.01); G03F 7/2002 (2013.01); G03F 7/2014 (2013.01); G03F 7/2037 (2013.01); G03F 7/32 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); H01L 21/0274 (2013.01); C08G 77/14 (2013.01);
Abstract

The present invention provides a silicone skeleton-containing polymer compound containing a repeating unit shown by the general formula (1) and having a weight average molecular weight of 3,000 to 500,000. There can be provided a silicone skeleton-containing polymer compound suitable used as a base resin of a chemically amplified negative resist composition that can remedy the problem of delamination generated on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern without generating a scum and a footing profile in the pattern bottom and on the substrate when the widely used 2.38% TMAH aqueous solution is used as a developer.

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