The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Jul. 25, 2017
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Jun Zhai, San Jose, CA (US);

Vidhya Ramachandran, Cupertino, CA (US);

Kunzhong Hu, Cupertino, CA (US);

Mengzhi Pang, Cupertino, CA (US);

Chonghua Zhong, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/08 (2006.01); H01L 27/06 (2006.01); H01L 21/77 (2017.01); H01L 49/02 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0641 (2013.01); H01L 21/77 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/16 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H01L 28/90 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24195 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01);
Abstract

In some embodiments, a system may include an integrated circuit. The integrated circuit may include a substrate including a first surface, a second surface substantially opposite of the first surface, and a first set of electrical conductors coupled to the first surface. The first set of electrical conductors may function to electrically connect the integrated circuit to a circuit board. The integrated circuit may include a semiconductor die coupled to the second surface of the substrate using a second set of electrical conductors. The integrated circuit may include a passive device dimensioned to be integrated with the integrated circuit. The passive device may be positioned between the second surface and at least one of the first set of electrical conductors. The die may be electrically connected to a second side of the passive device. A first side of the passive device may be available to be electrically connected to a second device.


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