The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Sep. 29, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

John Hopkins, Boise, ID (US);

Younghee Kim, Boise, ID (US);

Jie Li, Boise, ID (US);

Yu Yuwen, Boise, ID (US);

Ramey Abdelrahaman, Boise, ID (US);

Kunal Shrotri, Boise, ID (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11551 (2017.01); H01L 27/11524 (2017.01); H01L 29/10 (2006.01); H01L 29/788 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11524 (2013.01); H01L 27/11551 (2013.01); H01L 29/1033 (2013.01); H01L 29/7889 (2013.01);
Abstract

A 3D NAND storage device includes a plurality of layers containing doped semiconductor material interleaved with a plurality of layers of dielectric material. A first portion of the plurality of doped semiconductor material layers may be doped with a first dopant having a first dopant parameter. A second portion of the plurality of doped semiconductor material layers may be doped with a second dopant having a second dopant parameter. In embodiments, the first portion of the plurality of doped semiconductor layers may include a dopant at a concentration less than a defined threshold. In embodiments, the second portion of the plurality of doped semiconductor layers may include a dopant at a concentration less than the defined threshold. The differing dopant concentrations have been found to beneficially and advantageously affect the etch rate in the respective semiconductor layers when forming control gate recesses in the semiconductor layers.


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