The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Mar. 28, 2013
Applicant:

Novellus Systems, Inc., Fremont, CA (US);

Inventors:

Santosh Kumar, Beaverton, OR (US);

Bryan L. Buckalew, Tualatin, OR (US);

Steven T. Mayer, Aurora, OR (US);

Thomas Ponnuswamy, Sherwood, OR (US);

Chad Michael Hosack, Tigard, OR (US);

Robert Rash, West Linn, OR (US);

Lee Peng Chua, Beaverton, OR (US);

David Porter, Sherwood, OR (US);

Assignee:

Novellus Systems, Inc., Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B 3/02 (2006.01); C25D 7/12 (2006.01); B08B 3/04 (2006.01); H01L 21/67 (2006.01); C25D 17/00 (2006.01); C25D 21/00 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
B08B 3/022 (2013.01); B08B 3/041 (2013.01); C25D 7/12 (2013.01); C25D 17/00 (2013.01); C25D 17/001 (2013.01); C25D 21/00 (2013.01); C25D 21/12 (2013.01); H01L 21/67051 (2013.01);
Abstract

Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle.


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