The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Jan. 15, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ruqiang Bao, Niskayuna, NY (US);

Siddarth A. Krishnan, Newark, CA (US);

Unoh Kwon, Fishkill, NY (US);

Vijay Narayanan, New York, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 21/28 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823842 (2013.01); H01L 21/28088 (2013.01); H01L 21/823821 (2013.01); H01L 27/092 (2013.01); H01L 27/0924 (2013.01); H01L 29/4966 (2013.01); H01L 29/66545 (2013.01);
Abstract

A method for fabricating a gate stack of a semiconductor device comprises forming a first dielectric layer over a channel region of the device, depositing a first nitride layer on exposed portions of the first dielectric layer, depositing a scavenging layer on the first nitride layer, forming a capping layer over the scavenging layer, removing portions of the capping layer, the scavenging layer, and the first nitride layer to expose a portion of the first dielectric layer in an n-type field effect transistor (nFET) region of the gate stack, forming a barrier layer over the first dielectric layer and the capping layer, forming a first gate metal layer over the barrier layer, depositing a second nitride layer on the first gate metal layer, and depositing a gate electrode material on the second nitride layer.


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