The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Sep. 22, 2016
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kandabara N Tapily, Mechanicville, NY (US);

David L O'Meara, Albany, NY (US);

Kaushik A Kumar, Clifton Park, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/306 (2006.01); H01L 21/02 (2006.01); H01L 21/3115 (2006.01); H01L 21/308 (2006.01); H01L 21/768 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); H01L 21/0257 (2013.01); H01L 21/3085 (2013.01); H01L 21/3115 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/32135 (2013.01); H01L 21/32139 (2013.01); H01L 21/76877 (2013.01);
Abstract

Embodiments of the invention provide a processing method for bottom-up deposition of a film in a recessed feature. According to one embodiment, the method includes a) providing a substrate containing a recessed feature having a bottom and a sidewall, b) depositing a film on the bottom and on the sidewall of the recessed feature, and c) covering the film at the bottom of the recessed feature with a mask layer. The method further includes d) etching the film from the sidewall, and e) removing the mask layer to expose the film at the bottom of the recessed feature. Steps b)-e) may be repeated at least once until the film at the bottom of the recessed feature has a desired thickness. In one example, the recessed feature may be filled with the film.


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