The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2018
Filed:
Dec. 14, 2016
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Meng-Hsun Wan, Taipei, TW;
Yi-Shin Chu, Hsin-Chu, TW;
Szu-Ying Chen, Toufen Township, TW;
Pao-Tung Chen, Tainan Hsien, TW;
Jen-Cheng Liu, Hsin-Chu, TW;
Dun-Nian Yaung, Taipei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/062 (2012.01); H01L 31/113 (2006.01); H01L 27/146 (2006.01); H01L 31/0352 (2006.01); H01L 31/18 (2006.01); H01L 31/0224 (2006.01); H01L 31/0376 (2006.01); H04N 5/378 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14632 (2013.01); H01L 27/1463 (2013.01); H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H01L 27/14689 (2013.01); H01L 31/022466 (2013.01); H01L 31/03762 (2013.01); H01L 31/035218 (2013.01); H01L 31/18 (2013.01); H04N 5/378 (2013.01);
Abstract
A device includes an image sensor chip having formed therein an elevated photodiode, and a device chip underlying and bonded to the image sensor chip. The device chip has a read out circuit electrically connected to the elevated photodiode.