The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Jul. 07, 2017
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Ching-Yu Chang, Taipei, TW;

Ssu-I Fu, Kaohsiung, TW;

Yu-Hsiang Hung, Tainan, TW;

Chih-Kai Hsu, Tainan, TW;

Wei-Chi Cheng, Kaohsiung, TW;

Jyh-Shyang Jenq, Pingtung County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/768 (2006.01); H01L 29/423 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 21/28 (2006.01); H01L 21/8238 (2006.01); H01L 23/485 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/02274 (2013.01); H01L 21/2815 (2013.01); H01L 21/28132 (2013.01); H01L 21/28141 (2013.01); H01L 21/28247 (2013.01); H01L 21/31105 (2013.01); H01L 21/823431 (2013.01); H01L 21/823456 (2013.01); H01L 21/823462 (2013.01); H01L 21/823468 (2013.01); H01L 21/823864 (2013.01); H01L 27/0886 (2013.01); H01L 29/42364 (2013.01); H01L 29/6653 (2013.01); H01L 29/6656 (2013.01); H01L 29/66689 (2013.01); H01L 29/66719 (2013.01); H01L 23/485 (2013.01);
Abstract

A semiconductor device includes: a substrate, a gate structure on the substrate, and a spacer adjacent to the gate structure, in which the spacer extends to a top surface of the gate structure, a top surface of the spacer includes a planar surface, the spacer encloses an air gap, and the spacer is composed of a single material. The gate structure includes a high-k dielectric layer, a work function metal layer, and a low resistance metal layer, in which the high-k dielectric layer is U-shaped. The semiconductor device also includes an interlayer dielectric (ILD) layer around the gate structure and a hard mask on the spacer, in which the top surface of the hard mask is even with the top surface of the ILD layer.


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