The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2018
Filed:
Sep. 16, 2016
Intel Corporation, Santa Clara, CA (US);
Amit Sudhir Baxi, Bangalore, IN;
Vincent S. Mageshkumar, Navi Mumbai, IN;
Adel A. Elsherbini, Chandler, AZ (US);
Sasha Oster, Chandler, AZ (US);
Feras Eid, Chandler, AZ (US);
Aleksandar Aleksov, Chandler, AZ (US);
Johanna M. Swan, Scottsdale, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.