The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Feb. 22, 2013
Tokyo Electron Limited, Tokyo, JP;
Takashi Tanaka, Nirasaki, JP;
Yuichiro Inatomi, Nirasaki, JP;
Nobutaka Mizutani, Nirasaki, JP;
Yusuke Saito, Nirasaki, JP;
Mitsuaki Iwashita, Nirasaki, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layerserving as a barrier film on a substrate; baking the first plating layer; forming a second plating layerserving as a barrier film; and baking the second plating layer. A plating layer stacked bodyserving as a barrier film is formed of the first plating layerand the second plating layer
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile