The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
May. 26, 2016
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Kenji Suzuki, Tokyo, JP;
Takanobu Hotta, Nirasaki, JP;
Koji Maekawa, Nirasaki, JP;
Yasushi Aiba, Nirasaki, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/285 (2006.01); C23C 16/455 (2006.01); C23C 16/02 (2006.01); C23C 16/14 (2006.01); H01L 21/321 (2006.01); H01L 21/3205 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28556 (2013.01); C23C 16/0281 (2013.01); C23C 16/14 (2013.01); C23C 16/45525 (2013.01); H01L 21/28562 (2013.01); H01L 21/321 (2013.01); H01L 21/32051 (2013.01); H01L 21/76868 (2013.01); H01L 21/76876 (2013.01); H01L 21/76877 (2013.01);
Abstract
There is provided a method of reducing stress in a metal film that is highly stressed, the method including: processing the metal film by supplying a metal chloride gas containing a metal of the metal film and a reduction gas for reducing the metal chloride gas onto the metal film; and forming a process film on the metal film to reduce stress in the metal film.