The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Nov. 09, 2009
Applicants:

Yu Cao, Cupertino, CA (US);

Wenjin Shao, Sunnyvale, CA (US);

Hanying Feng, Fremont, CA (US);

Fei Du, Santa Clara, CA (US);

Martin Snajdr, Millbrae, CA (US);

Inventors:

Yu Cao, Cupertino, CA (US);

Wenjin Shao, Sunnyvale, CA (US);

Hanying Feng, Fremont, CA (US);

Fei Du, Santa Clara, CA (US);

Martin Snajdr, Millbrae, CA (US);

Assignee:

ASML Netherlands B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/705 (2013.01); G03F 7/70666 (2013.01);
Abstract

The present invention generally relates to simulating a lithographic process, and more particularly to methods for smart selection and smart weighting when selecting parameters and/or kernels used in aerial image computation. According to one aspect, advantages in simulation throughput and/or accuracy can be achieved by selecting TCC kernels more intelligently, allowing highly accurate aerial images to be simulated using a relatively fewer number of TCC kernels than in the state of the art. In other words, the present invention allows for aerial images to be simulated with the same or better accuracy using much less simulation throughput than required in the prior art, all else being equal.


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