The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

May. 22, 2015
Applicant:

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Hui-Chan Yun, Suwon-si, KR;

Woo-Han Kim, Suwon-si, KR;

Sang-Ran Koh, Suwon-si, KR;

Taek-Soo Kwak, Suwon-si, KR;

Bo-Sun Kim, Suwon-si, KR;

Jin-Gyo Kim, Suwon-si, KR;

Yoong-Hee Na, Suwon-si, KR;

Kun-Bae Noh, Suwon-si, KR;

Sae-Mi Park, Suwon-si, KR;

Jin-Hee Bae, Suwon-si, KR;

Jun Sakong, Suwon-si, KR;

Eun-Seon Lee, Suwon-si, KR;

Wan-Hee Lim, Suwon-si, KR;

Jun-Young Jang, Suwon-si, KR;

Il Jung, Suwon-si, KR;

Byeong-Gyu Hwang, Suwon-si, KR;

Assignee:

Samsung SDI Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/469 (2006.01); H01L 21/02 (2006.01); C01B 33/12 (2006.01); C09D 1/00 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02222 (2013.01); C01B 33/12 (2013.01); C09D 1/00 (2013.01); H01L 21/02164 (2013.01); H01L 21/02216 (2013.01); H01L 21/02282 (2013.01); H01L 29/0649 (2013.01);
Abstract

A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.


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