The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Dec. 04, 2014
Applicant:
Hermes Microvision Inc., Hsin-Chu, TW;
Inventors:
Zhongwei Chen, San Jose, CA (US);
Jack Jau, Los Altos Hills, CA (US);
Weiming Ren, San Jose, CA (US);
Assignee:
HERMES MICROVISION INC., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/28 (2006.01); H01J 37/26 (2006.01); H01J 37/10 (2006.01); H01J 37/14 (2006.01); H01J 37/20 (2006.01); H01J 37/22 (2006.01); H01J 37/244 (2006.01); H01J 37/02 (2006.01); H01J 37/285 (2006.01); H01J 37/29 (2006.01);
U.S. Cl.
CPC ...
H01J 37/28 (2013.01); H01J 37/026 (2013.01); H01J 37/10 (2013.01); H01J 37/14 (2013.01); H01J 37/20 (2013.01); H01J 37/22 (2013.01); H01J 37/244 (2013.01); H01J 37/261 (2013.01); H01J 37/285 (2013.01); H01J 37/292 (2013.01); H01J 2237/04926 (2013.01); H01J 2237/1405 (2013.01); H01J 2237/24475 (2013.01); H01J 2237/24495 (2013.01); H01J 2237/24528 (2013.01); H01J 2237/2801 (2013.01); H01J 2237/2804 (2013.01); H01J 2237/2806 (2013.01); H01J 2237/2814 (2013.01);
Abstract
The present invention provides apparatuses to inspect small particles on the surface of a sample such as wafer and mask. The apparatuses provide both high detection efficiency and high throughput by forming Dark-field BSE images. The apparatuses can additionally inspect physical and electrical defects on the sample surface by form SE images and Bright-field BSE images simultaneously. The apparatuses can be designed to do single-beam or even multiple single-beam inspection for achieving a high throughput.