The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Oct. 20, 2015
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

John Daugherty, Fremont, CA (US);

David Trussell, Fremont, CA (US);

Michael Kellogg, Fremont, CA (US);

Christopher Pena, Fremont, CA (US);

Richard Gould, Fremont, CA (US);

Klay Kunkel, Fremont, CA (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67196 (2013.01); H01L 21/6719 (2013.01); H01L 21/67161 (2013.01); H01L 21/67201 (2013.01); H01L 21/67727 (2013.01); H01L 21/67742 (2013.01); H01L 21/67745 (2013.01); H01L 21/67754 (2013.01); H01L 21/67769 (2013.01);
Abstract

A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.


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