The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Aug. 19, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kenta Saiki, Nirasaki, JP;

Toshihiko Tanaka, Nirasaki, JP;

Muneaki Tamura, Nirasaki, JP;

Kazuhiko Koshimizu, Beaverton, OR (US);

Shinji Akaike, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/067 (2006.01); G01R 31/27 (2006.01); G01R 31/26 (2014.01);
U.S. Cl.
CPC ...
G01R 1/06794 (2013.01); G01R 31/2601 (2013.01); G01R 31/27 (2013.01);
Abstract

A contact position of a probe needle with respect to electrode padstoof a semiconductor device is inspected in advance when performing an inspection by a prober on the semiconductor device formed on a wafer W placed on a stage. A reticleon which shapestoindicating positions of the probe needles are formed is placed instead of the probe needles at a position where the probe needles are arranged. The semiconductor device formed on the wafer W is imaged by the imaging unitthrough the reticle. A positional relationship between the shapes formed on the reticleand the electrode padstois analyzed from the image. When necessary, a position of the stageis adjusted such that centers of the shapestoand centers of the electrode padtoare coincident.


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