Penang, Malaysia

Zurina Binti Zukiffly


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2012-2013

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2 patents (USPTO):Explore Patents

Title: Innovations by Zurina Binti Zukiffly

Introduction

Zurina Binti Zukiffly is a notable inventor based in Penang, Malaysia. She has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase her innovative spirit and technical expertise.

Latest Patents

Her latest patents include a "Thermally Enhanced Semiconductor Package System." This invention features a semiconductor package system that comprises a semiconductor chip and a substrate with a substrate opening and a vertical build-up wing. The design allows for efficient heat management, with a first heat slug attached above the substrate and a second heat slug connected through the substrate opening. Another patent, "Hyper Thermally Enhanced Semiconductor Package System Comprising Heat Slugs on Opposite Surfaces of a Semiconductor Chip," further enhances this technology by incorporating heat slugs on both surfaces of the semiconductor chip, ensuring optimal thermal performance.

Career Highlights

Zurina is currently employed at Stats Chippac Pte. Ltd., where she continues to develop innovative solutions in semiconductor packaging. Her work has been instrumental in advancing the efficiency and reliability of semiconductor devices.

Collaborations

She collaborates with talented colleagues, including You Yang Ong and Saat Shukri Bin Embong, to drive innovation within her team.

Conclusion

Zurina Binti Zukiffly's contributions to semiconductor technology reflect her dedication to innovation and excellence. Her patents not only demonstrate her technical skills but also her commitment to advancing the field.

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