Hong Kong, China

Zongjin Li

This inventor holds 1 USPTO granted patent. Top assignee: Rsm Technologies Limited. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zongjin Li. Retrieved from https://idiyas.com/inventor/zongjin-li-om3cj7vn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 37(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Zongjin Li: Innovator in Acoustic Attenuation Materials

Introduction

Zongjin Li is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of acoustic materials, particularly through his innovative patent related to sound energy absorption.

Latest Patents

Zongjin Li holds a patent for acoustic attenuation materials. This invention comprises outer layers of a stiff material sandwiching a relatively soft elastic material. Within the elastic material, means such as spheres, discs, or wire mesh are provided to generate local mechanical resonances. These resonances function to absorb sound energy at tunable wavelengths, showcasing a novel approach to sound attenuation.

Career Highlights

Zongjin Li is associated with RSM Technologies Limited, where he applies his expertise in developing advanced acoustic materials. His work has positioned him as a key figure in the innovation of sound absorption technologies.

Collaborations

Zongjin Li has collaborated with notable colleagues, including Ping Sheng and Man Tse. Their combined efforts contribute to the advancement of research in acoustic materials.

Conclusion

Zongjin Li's innovative work in acoustic attenuation materials highlights his role as a leading inventor in the field. His contributions continue to influence the development of sound absorption technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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