Beijing, China

Zongde Liu

This inventor holds 1 USPTO granted patent. Top assignees: North China Electric Power University, Oceanshield Pte Ltd. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zongde Liu. Retrieved from https://idiyas.com/inventor/zongde-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Zongde Liu and Marine Biofouling Prevention

Introduction

Zongde Liu is an inventor associated with Beijing, China. His work includes a patent for a coating designed to prevent marine biofouling. The patent describes a metal-cladding approach that uses a copper-based alloy.

Latest Patents

Liu is credited with 1 patent: “Coating for Preventing Marine Biofouling and Preparation Method Thereof.” The invention describes a metastable-phase antifouling cladding layer applied to a metal substrate. It contains dispersed iron-rich precipitates and a copper-rich solid solution with supersaturated iron, based on a Cu–Fe–Sn–Si–P alloy.

The specified alloy powder contains 8% to 40% iron, 0.3% to 8% tin, 0.1% to 0.5% silicon, and 0.1% to 0.5% phosphorus by mass, with copper making up the balance. The patent identifies steel, copper alloy, titanium alloy, and aluminum alloy as possible substrates. It also covers a method for preparing the coating.

Career Highlights

The supplied information associates Liu with North China Electric Power University and Oceanshield Pte Ltd. These affiliations connect his profile with both an academic institution and a company.

Collaborations

Herong Ma and Zhongxun Liu are identified as Liu’s coworkers. The available information does not specify their roles in the patent or the nature of their collaborations.

Conclusion

Zongde Liu’s listed patent focuses on a copper-based alloy coating intended to prevent marine biofouling on metal substrates.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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