Company Filing History:
Years Active: 2004
Title: Ziv Atsmon: Innovator in Bonding Technology
Introduction
Ziv Atsmon is a notable inventor based in Zihron-Yakov, Israel. He has made significant contributions to the field of bonding technology, particularly with his innovative patent that addresses the challenges of fine wire bonding.
Latest Patents
Atsmon holds a patent for an "Ultra fine pitch capillary," which is a specialized bonding tool designed for connecting fine wires to bonding pads with very fine pitches. This tool features a working tip that includes a tapered section with a specific angle, a working face with two annular chamfers, and a cylindrical axial passage. The bonding tool is constructed from a material that contains at least 80% ZrO by weight, ensuring durability and effectiveness in its application.
Career Highlights
Ziv Atsmon is associated with Kulicke and Soffa Investments, Inc., a company known for its advancements in semiconductor packaging and assembly equipment. His work at the company has allowed him to focus on developing innovative solutions that enhance the efficiency and precision of bonding processes.
Collaborations
Throughout his career, Atsmon has collaborated with talented individuals such as Gil Perlberg and Benjamin Sonnenreich. These partnerships have contributed to the development of cutting-edge technologies in the bonding field.
Conclusion
Ziv Atsmon's contributions to bonding technology through his patent and work at Kulicke and Soffa Investments, Inc. highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of bonding solutions.