This inventor holds 5 USPTO granted patents. Top assignees: Clamco Corporation, Heleron Corporation, Other. Active years: 1979-1998.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1979-1998
Title: Zigmunt J Walkiewicz, Jr: Innovator in Packaging Technology
Introduction
Zigmunt J Walkiewicz, Jr. is a notable inventor based in Chagrin Falls, OH (US). He has made significant contributions to the field of packaging technology, holding a total of 5 patents. His innovative designs have improved the efficiency and effectiveness of packaging processes.
Latest Patents
Among his latest patents is the "Horizontal wrapper with a side seal attachment." This invention provides a continuously operating machine for wrapping articles with heat shrinkable plastic film automatically and sequentially. The machine transfers articles along a horizontal pathway to various processing stations, where they are tubularly overwrapped and sealed. The design includes a heat seal and trim unit that engages the film tube's free side edges and trims excess material away. Another notable patent is the "Electrical impulse hot hole punch for making a tear-resistant hole in a sheet of thermoplastic film." This apparatus features an electric heating element that moves selectively to create a tear-resistant hole in the film, enhancing the durability of the packaging.
Career Highlights
Zigmunt has worked with several companies throughout his career, including Clamco Corporation and Heleron Corporation. His experience in these organizations has contributed to his expertise in packaging technology and innovation.
Collaborations
He has collaborated with notable coworkers such as David W O'Brien and Franck E Hansen, further enriching his professional journey and contributions to the industry.
Conclusion
Zigmunt J Walkiewicz, Jr. is a distinguished inventor whose work in packaging technology has led to significant advancements in the field. His patents reflect a commitment to innovation and efficiency in packaging processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile