Beijing, China

Zi-Peng Wu

USPTO Granted Patents = 2 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019-2020

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2 patents (USPTO):Explore Patents

Title: Innovations of Inventor Zi-Peng Wu

Introduction

Zi-Peng Wu is a notable inventor based in Beijing, China. He has made significant contributions to the field of bonding methods utilizing advanced materials such as carbon nanotubes. With a total of 2 patents, his work showcases innovative approaches to enhance bonding techniques in various applications.

Latest Patents

One of his latest patents is a bonding method using a carbon nanotube structure. This method involves utilizing carbon nanotubes to bond two objects together by applying pressure, ensuring a strong connection. The carbon nanotube structure comprises a super-aligned carbon nanotube film, which enhances the bonding process. Another significant patent is the bonding method of fixing an object to a rough surface. This method employs a sheet structure with controlled surface roughness and utilizes carbon nanotubes to achieve effective bonding with substrates.

Career Highlights

Zi-Peng Wu has worked with prestigious institutions, including Tsinghua University and Hon Hai Precision Industry Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative bonding techniques.

Collaborations

Throughout his career, Zi-Peng Wu has collaborated with talented individuals such as Xiang Jin and Wen-Tao Miao. These collaborations have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Zi-Peng Wu's contributions to the field of bonding methods through his innovative use of carbon nanotubes highlight his role as a significant inventor. His patents reflect a commitment to advancing technology and improving bonding techniques in various applications.

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